- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/72 - Means for accommodating flexible lead within the holder
Patent holdings for IPC class H01R 13/72
Total number of patents in this class: 252
10-year publication summary
21
|
35
|
32
|
32
|
35
|
40
|
32
|
17
|
18
|
8
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Yazaki Corporation | 6282 |
6 |
Harman Professional Inc | 86 |
6 |
Chatsworth Products, Inc. | 225 |
5 |
Hewlett-Packard Development Company, L.P. | 28538 |
4 |
Ford Global Technologies, LLC | 19702 |
4 |
Steelcase Inc. | 1361 |
4 |
Eaton Intelligent Power Limited | 6113 |
4 |
Dongguan Ceesing Intelligent Device Manufacturing Co., Ltd | 8 |
4 |
Hubbell Incorporated | 3052 |
3 |
CommScope Technologies LLC | 4937 |
3 |
Crestron Electronics Inc. | 649 |
3 |
Mobile Tech, Inc. | 140 |
3 |
Polygroup Macau Limited (BVI) | 122 |
3 |
Scosche Industries, Inc. | 191 |
3 |
SNAP-ON Incorporated | 1385 |
3 |
Titan3 Technology LLC | 173 |
3 |
One-Eyed Pilot Innovations, Inc. | 4 |
3 |
International Business Machines Corporation | 60644 |
2 |
Toyota Motor Corporation | 28582 |
2 |
Panasonic Avionics Corporation | 299 |
2 |
Other owners | 182 |